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:Tungsten Creates New VIA 3D Stack
Tungsten Creates New VIA 3D Stack
Jan 10, 2009, 04 :33 UTC (0 Talkback[s]) (4747 reads)

(Other stories by Michael Larabel)

"This work done by Thomas includes a memory manager similar to the Graphics Execution Manager and a stable AGP command submission mechanism. This new code will also allow for kernel mode-setting on VIA hardware in the future.

"The new Mesa component features OpenGL 1.3 support, accelerated pixel operations and pixel buffer objects, S3TC compression, accelerated GL_EXT frame buffer objects, better stability, and multi-thread / multi-context operation support."

Complete Story

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