Tungsten Creates New VIA 3D Stack Jan 10, 2009, 04 :33 UTC (0 Talkback[s]) (3709 reads) (Other stories by Michael Larabel)
"This work done by Thomas includes a memory manager similar to the Graphics Execution Manager and a stable AGP command submission
mechanism. This new code will also allow for kernel mode-setting on VIA hardware in the future.
"The new Mesa component features OpenGL 1.3 support, accelerated pixel operations and pixel
buffer objects, S3TC compression, accelerated GL_EXT frame buffer objects, better stability, and multi-thread / multi-context operation support."
