Tungsten Creates New VIA 3D Stack
Jan 10, 2009, 04:33 (0 Talkback[s])
(Other stories by Michael Larabel)
How to Help Your Business Become an AI Early Adopter
"This work done by Thomas includes a memory manager similar to
the Graphics Execution Manager and a stable AGP command submission
mechanism. This new code will also allow for kernel mode-setting on
VIA hardware in the future.
"The new Mesa component features OpenGL 1.3 support, accelerated
pixel operations and pixel buffer objects, S3TC compression,
accelerated GL_EXT frame buffer objects, better stability, and
multi-thread / multi-context operation support."