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Free pre-release board from Intel

Aug 27, 2009, 23:32 (0 Talkback[s])


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"Intel, in conjunction with the Intel® Embedded and Communications Alliance (Intel® ECA), is accepting customer applications for the Intel® Embedded Pre-release Seed Board Program.

"This program is designed to help customers jump-start development of key projects with the latest processor technology on the embedded Intel® architecture roadmap.

"If your application is accepted¹, you may become eligible to receive a complimentary pre-release motherboard² based on one of Intel’s next generation hardware platforms.

"You must already have a Corporate Non-disclosure Agreement (CNDA³) with Intel, and you must agree to the INTEL EMBEDDED PRE-RELEASE MATERIAL PROGRAM TERMS. Your application must be received by September 24, 2009."

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