[ Thanks to An Anonymous Reader for
this link. ]
“Intel, in conjunction with the Intel® Embedded and
Communications Alliance (Intel® ECA), is accepting customer
applications for the Intel® Embedded Pre-release Seed Board
Program.“This program is designed to help customers jump-start
development of key projects with the latest processor technology on
the embedded Intel® architecture roadmap.“If your application is accepted¹, you may become eligible
to receive a complimentary pre-release motherboard² based on
one of Intel’s next generation hardware platforms.“You must already have a Corporate Non-disclosure Agreement
(CNDA³) with Intel, and you must agree to the INTEL EMBEDDED
PRE-RELEASE MATERIAL PROGRAM TERMS. Your application must be
received by September 24, 2009.”